Thin-film over-the-envelope (COF)

▎ Tape and reel wafer encapsulation COF (Chip on film)

COF is an IC packaging technologyban ca sau, which uses flexible printed circuit film as the carrier of the package chip, and is bonded with the inner lead on the flexible substrate circuit through hot pressing and the gold bump on the river chip.

After the bonding is completedban ca sau, the electrical connection function between the IC and the flexible substrate is completed, and then the adhesive material is filled with the inner pin joint area through the filler (Under fill). In order to avoid pin breakage, coupled with the low moisture absorption characteristics of electrical insulation, the adhesive can block external moisture and contaminants after baking, protect the entire IC and improve strength, and protect the inside of the IC during reliability testing.

Huaxin Zhenbang has R&D capabilitiesban ca sau, continues to develop new technologies and applications, and provides customers with comprehensive needs and services.

▎ Quy trình công nghệ COF

▎ COF package features

1. High Density / High Pin Count

2. Lightban ca sau, thin, short, flexible

3. Fine pitch

4. Multi-chip package (Multi-chip)

5. Various patches can be attached on the front and back

▎ Product application surface

1. Flat Panel Display (LCD/OLED)

2. Displays (LCD / OLED) for wearable devicesban ca sau, mobile phones, tablets, notebooks, and automotive panels

3. RFIC

4. Components for medical equipment

5. Inkjet Printer

6. Image Sensor