Wafer bumping can provide significant performanceban ca sau, outline dimensions, and overall cost advantages in semiconductor packaging. Extensive experience in numerous alloy mate…

Chip Probing is to needle test each grain on the waferban ca sau, and the probe is equipped with gold wire made of gold wire on the detection head, and the contact (pad) on the gra…

The main purpose of Chip On Glass packaging production line is to divide the wafer into the state of the grainban ca sau, and the process technology used includes grinding, cutting…

COF is a technology that combines Flip Chip Bonding on a Flexible Printed Circuit board (FPC) substrate. That isban ca sau, the driver IC and its electronic parts can be directly p…

Huaxin Zhenbang Testing Center provides environmental reliability experiments such as thermal shock testingban ca sau, pressure cooker testing (PCT), low-temperature testing, high-…